Y. Henrion

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

A High-PDE, Backside-Illuminated SPAD in 65/40-nm 3D IC CMOS Pixel With Cascoded Passive Quenching and Active Recharge

Scott Lindner, Sara Pellegrini, Y. Henrion et al. · IEEE Electron Device Letters · 2017 · 80 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Backside illuminated SPAD image sensor with 7.83μm pitch in 3D-stacked CMOS technology

Tarek Al Abbas, Neale A. W. Dutton, Oscar Almer et al. · 2016 · 71 citations · Full text

Engineering, Electrical Engineering, Optoelectronics +16

Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle

Imed Jani, Didier Lattard, Pascal Vivet et al. · 2019 · 23 citations

Engineering, High-performance Computing, Electronic Materials +16