Concepedia

Bongsub Lee

BL

Statistics

Publications

16

Citations

459

H-Index

13

Active since

2010

Affiliations

Xperi (United States)(Current)

University of Illinois Urbana-Champaign

Bongsub Lee is an author at Xperi (United States) specializing in engineering, electronic materials, and die-to-wafer bonding.

Publications per year

2010–2023

16

Publications

16

Observation and modeling of polycrystalline grain formation in Ge2Sb2Te5

Geoffrey W. Burr, Pierre Tchoulfian, Teya Topuria et al. · Journal of Applied Physics · 2012 · 70 citations

Natural Sciences, Materials Science, Physics +17

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 63 citations

Engineering, Materials Engineering, Materials Science +16

The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

Laura Mirkarimi, Cyprian Uzoh, Dominik Suwito et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 41 citations

Engineering, Materials Engineering, Materials Science +17

Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

Guilian Gao, Laura Mirkarimi, G. G. Fountain et al. · 2018 · 39 citations

Engineering, Manufacturing Engineering, Microfabrication +16

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao, Thomas Workman, Cyprian Uzoh et al. · 2020 · 39 citations

Engineering, Manufacturing Engineering, Materials Science +17

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