John B. Matovu

Fundamental Investigation of Chemical Mechanical Polishing of GaAs in Silica Dispersions: Material Removal and Arsenic Trihydride Formation Pathways

John B. Matovu, Patrick Ong, Leonardus H. A. Leunissen et al. · ECS Journal of Solid State Science and Technology · 2013 · 41 citations

Engineering, Materials Engineering, Materials Science +17

Use of Multifunctional Carboxylic Acids and Hydrogen Peroxide To Improve Surface Quality and Minimize Phosphine Evolution During Chemical Mechanical Polishing of Indium Phosphide Surfaces

John B. Matovu, Patrick Ong, Leonardus H. A. Leunissen et al. · Industrial & Engineering Chemistry Research · 2013 · 34 citations

Engineering, Materials Engineering, Materials Science +17

Chemical Mechanical Polishing of Ge in Hydrogen Peroxide-Based Silica Slurries: Role of Ionic Strength

John B. Matovu, Naresh K. Penta, Shivaji Peddeti et al. · Journal of The Electrochemical Society · 2011 · 27 citations

Engineering, Chemical Engineering, Environmental Engineering +13

Role of polycation adsorption in poly-Si, SiO2 and Si3N4 removal during chemical mechanical polishing: Effect of polishing pad surface chemistry

Naresh K. Penta, John B. Matovu, P. R. Dandu Veera et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 2011 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide–based silica slurries containing oxalic acid or citric acid

John B. Matovu, Patrick Ong, Lieve Teugels et al. · Microelectronic Engineering · 2013 · 12 citations

Engineering, Materials Engineering, Materials Science +14