International Electronics Manufacturing Technology Symposium

Low Cost Flip Chip Technology

M.T.W. de Langen · 1997 · 103 citations

Engineering, Computer Engineering, Electrical Engineering +11

A New Approach To Cu-cu Direct Bump Bonding

Tadatomo Suga, F. Yuuki, N. Hosoda · 1997 · 13 citations

Engineering, Materials Engineering, Materials Science +14

Materials Performance At Frequencies Up To 20 Ghz

Daniel I. Amey, S. Horowitz · 1997 · 12 citations

Natural Sciences, Materials Engineering, Materials Science +15

Bonding Resistance Of Sbb Technique

Masahiro J. Go, Y. Tomura, Y. Bessho et al. · 1997 · 12 citations

Engineering, Dental Materials Science, Materials Science +6

Electronics Packaging Technology Update: BGA, CSP, DCA, And Flip Chip

Lau · 1997 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +14