Concepedia
International Electronics Manufacturing Technology Symposium · 1997 · 103 citations · 1 references
Chip-scale PackageEngineeringMicrofabricationChip On BoardComputer EngineeringComputer ArchitectureChip AttachmentElectronic PackagingTechnologyMicroelectronics
1
Low-cost flip-chip on board
A.F.J. Baggerman, J.F.J.M. Caers, J.J. Wondergem et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1996 · 30 citations
3D Ic Architecture, Electrical Engineering, Chip-scale Package +15