Concepedia

Y. Bessho

YB

Statistics

Publications

4

Citations

70

H-Index

4

Active since

1997

Affiliations

Panasonic (Japan)(Current)

Y. Bessho is an author at Panasonic (Japan) specializing in engineering, chip packaging, and materials science.

Publications per year

1997–2005

4

Publications

4

A Stud-bump-bonding Technique For High Density Multi-chip-module

Y. Bessho, Y. Tomura, Y. Hakotani et al. · 2005 · 25 citations

, , +13

Development of chip-on-flex using SBB flip-chip technology

Yutaka Kumano, Y. Tomura, Minehiro Itagaki et al. · Microelectronics Reliability · 2001 · 23 citations

, , +9

Bonding Resistance Of Sbb Technique

Masahiro J. Go, Y. Tomura, Y. Bessho et al. · International Electronics Manufacturing Technology Symposium · 1997 · 12 citations

, , +6

Stud-bump bonding technique onto an advanced organic substrate for MCM-Ls

T. Shiraishi, K. Amami, S. Yuhaku et al. · 2002 · 10 citations

, , +17

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