Daniel I. Amey - Concepedia

Author

Daniel I. Amey

DuPont (United States)

Also Known As

D. Amey, D.I. Amey, Daniel Amey, Daniel I. Amey

Publications

412

Citations

H-Index

Concepts

All Affiliations

DuPont (United States)Georgia Institute of Technology

About

Daniel I. Amey is an author at DuPont (United States) specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	10	10	354
2	Electrical Engineering	9	9	182
3	Applied Physics	5	5	245
4	Computer Engineering	4	4	259
5	Materials Engineering	3	3	40

Daniel I. Amey

Publications

354

Citations

H-Index

Page 1

	Year	Citations
Proceedings of SPIE - The International Society for Optical Engineering Can Akgün, Rhonda Franklin, Daniel I. Amey, Optical DesignPhotonicsOptical MaterialsEngineeringInternational Society	2003	172
Microwave properties of ceramic materials Daniel I. Amey, J.P. Curilla EngineeringMicrowave TransmissionCeramic PowdersElectrical PropertiesTest Method	2002	33
Improved Electrical Performance Required for Future MOS Packaging L. Schaper, Daniel I. Amey IEEE Transactions on Components Hybrids and Manufacturing Technology Nonlimiting Electrical EnvironmentElectrical EngineeringChip-scale PackageEngineeringVlsi Design	1983	33
Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package P. Muthana, A. Ege Engin, Madhavan Swaminathan, IEEE Transactions on Advanced Packaging EngineeringVlsi DesignComputer ArchitectureInterconnection Network ArchitecturePower Electronics	2007	30
Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors P. Muthana, K. Srinivasan, A. Ege Engin, IEEE Transactions on Advanced Packaging Low-power ElectronicsElectrical EngineeringEngineeringCircuit SystemEmbedded Planar Capacitors	2008	24
High frequency electrical characterization of electronic packaging materials: environmental and process considerations Daniel I. Amey, S. Horowitz, R.L. Keusseyan EngineeringHigh Frequency DataElectromagnetic CompatibilityAdvanced Packaging (Semiconductors)Printed Electronics	2002	16
Materials Performance At Frequencies Up To 20 Ghz Daniel I. Amey, S. Horowitz International Electronics Manufacturing Technology Symposium EngineeringAdvanced Ceramic MaterialsElectrical PropertiesCeramic Matrix CompositeMaterials Performance	1997	12
A new low loss lead free LTCC system for wireless and RF applications C. Donahue, Barry E. Taylor, Daniel I. Amey, Materials EngineeringMaterials ScienceElectrical EngineeringRf ApplicationsEngineering	2002	12
A new approach for opto-electronic/MEMS packaging R.L. Keusseyan, J. Sosnowski, Matthew Doyle, Materials ScienceElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)	2003	12
Ceramic technology for integrated packaging for wireless Daniel I. Amey, Peter Barnwell, Richard L. Brown, Advanced PackagingMaterials ScienceElectrical EngineeringMicrowave TechnologiesEngineering	2003	10

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