A. Ege Engin

Modeling of Crosstalk in Through Silicon Vias

A. Ege Engin, Srinidhi Raghavan Narasimhan · IEEE Transactions on Electromagnetic Compatibility · 2012 · 112 citations

Engineering, Electrical Engineering, Circuit Theory +16

Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes

A. Ege Engin, Krishna Bharath, Madhavan Swaminathan · IEEE Transactions on Electromagnetic Compatibility · 2007 · 89 citations

Engineering, Computational Engineering, Electrical Engineering +14

Modeling of striplines between a power and a ground plane

A. Ege Engin, W. John, G. Sommer et al. · IEEE Transactions on Advanced Packaging · 2006 · 73 citations

Engineering, Electrical Engineering, Circuit Theory +16

Finite-Difference Modeling of Noise Coupling between Power/Ground Planes in Multilayered Packages and Boards

A. Ege Engin, Krishna Bharath, Madhavan Swaminathan et al. · 2006 · 48 citations

Engineering, Computer Engineering, Electrical Engineering +17

Extraction of Dielectric Constant and Loss Tangent Using New Rapid Plane Solver and Analytical Debye Modeling for Printed Circuit Boards

A. Ege Engin · IEEE Transactions on Microwave Theory and Techniques · 2009 · 40 citations

Natural Sciences, Electrical Engineering, Materials Science +17