Multiscale Thermal Impact of BSPDN: SoC Hotspot Challenges and Partial Mitigation

Abstract

Realistic workload-based CPU powermaps reveal that nonuniform dissipation majorly accentuates hotspots in BSPDN based designs. 1 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mu m$</tex> -resolution temperature simulations of an 80-core server SoC show ~ 14°C penalties relative to FSPDN caused by interplay of extraneous thermal resis-tance (BEOL + wafer bonding) and BSPDN heat spreading. Mitigation strategies are proposed and quantified.