High reliability of piezoresistive pressure sensors by wafer to wafer direct bonding at room temperature

Review: Semiconductor Piezoresistance for Microsystems

A.A. Barlian, Woo‐Tae Park, Joseph R. Mallon et al. · Proceedings of the IEEE · 2009 · 932 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Wafer level packaging of MEMS

Masayoshi Esashi · Journal of Micromechanics and Microengineering · 2008 · 353 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators

Rob N. Candler, Matthew A. Hopcroft, Bongsang Kim et al. · Journal of Microelectromechanical Systems · 2006 · 205 citations

Engineering, Materials Engineering, Materials Science +17

Mechanisms for room temperature direct wafer bonding

Thomas Plach, Kurt Hingerl, Sajjad Tollabimazraehno et al. · Journal of Applied Physics · 2013 · 188 citations

Engineering, Materials Engineering, Materials Science +17

Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

Silke Christiansen, Rajendra Singh, U. Gösele · Proceedings of the IEEE · 2006 · 174 citations

Engineering, Materials Engineering, Materials Science +16