Concepedia

Publication | Open Access

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

DOIFull Paper Access

29

Citations

40

References

2022

Year

Siliang He, Yu-An Shen, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa
Journal of Materials Research and Technology

References

YearCitations

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