Wangyun Li

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Yuxin Xu, Xiaoming Qiu, Wangyun Li et al. · Journal of Materials Research and Technology · 2023 · 32 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Siliang He, Yu-An Shen, Bifu Xiong et al. · Journal of Materials Research and Technology · 2022 · 31 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

H. Qin, Wangyun Li, Min-Bo Zhou et al. · Microelectronics Reliability · 2014 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +17

Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

Wangyun Li, X.P. Zhang, Hongbo Qin · Microelectronics Reliability · 2017 · 25 citations

Engineering, Materials Engineering, Materials Science +17

Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing

Hongbo Qin, Tianhan Liu, Wangyun Li et al. · Microelectronics Reliability · 2020 · 19 citations

Engineering, Materials Engineering, Materials Science +17