Concepedia

Wangyun Li

WL

Statistics

Publications

10

Citations

179

H-Index

10

Active since

2014

Affiliations

Guilin University of Electronic Technology(Current)

The University of Osaka

South China University of Technology

Wangyun Li is an author at Guilin University of Electronic Technology specializing in engineering, materials science, and mechanical engineering.

ORCID

Top concepts

Publications per year

2014–2023

10

Publications

10

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Siliang He, Yu-An Shen, Bifu Xiong et al. · Journal of Materials Research and Technology · 2022 · 29 citations · Full text

Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

H. Qin, Wangyun Li, Min-Bo Zhou et al. · Microelectronics Reliability · 2014 · 28 citations

, , +3

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Yuxin Xu, Xiaoming Qiu, Wangyun Li et al. · Journal of Materials Research and Technology · 2023 · 25 citations · Full text

Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

Wangyun Li, X.P. Zhang, Hongbo Qin · Microelectronics Reliability · 2017 · 22 citations

, , +12

Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing

Hongbo Qin, Tianhan Liu, Wangyun Li et al. · Microelectronics Reliability · 2020 · 19 citations

, , +9

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