Publication | Closed Access
Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing
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Citations
27
References
2020
Year
Materials EngineeringElectrical EngineeringFriction WeldingEngineeringApplied PhysicsMicrostructure InhomogeneityWeld Pool SolidificationTemperature GradientElectronic PackagingMicroelectronicsCurrent StressingMicrostructure
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