Concepedia
Statistics
Publications
3
Citations
55
H-Index
Active since
2022
Affiliations
Feng Chia University(Current)
Guilin University of Electronic Technology
Institute of Semiconductors
Guangdong Academy of Sciences
Bifu Xiong is an author at Feng Chia University specializing in surface science, melting temperature, and steaming.
Publications per year
2022–2023
Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
Siliang He, Yu-An Shen, Bifu Xiong et al. · Journal of Materials Research and Technology · 2022 · 31 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +14
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
Siliang He, Bifu Xiong, Fangyi Xu et al. · Materials · 2023 · 14 citations · Full text
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere
Bifu Xiong, Siliang He, Jinguo Ge et al. · Soldering and Surface Mount Technology · 2023 · 10 citations
Natural Sciences, Materials Engineering, Materials Science +13
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