Fupeng Huo

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Siliang He, Yu-An Shen, Bifu Xiong et al. · Journal of Materials Research and Technology · 2022 · 29 citations · Full text

Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties

Fupeng Huo, Zhi Hao Jin, Duy Le Han et al. · Journal of Material Science and Technology · 2022 · 27 citations

Materials Engineering, Materials Science, Engineering +6

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Duy Le Han, Yu-An Shen, Fupeng Huo et al. · Metals · 2021 · 26 citations · Full text

Engineering, Severe Plastic Deformation, Mechanical Engineering +16

Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach

Jianhao Wang, Xunda Liu, Fupeng Huo et al. · Materials Research Bulletin · 2022 · 26 citations

Materials Engineering, Materials Science, Engineering +9

Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation

Fupeng Huo, Zhi Hao Jin, Duy Le Han et al. · Materials & Design · 2021 · 25 citations · Full text

Plain Solder, Engineering, Mechanical Engineering +17