Publication | Open Access

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Materials ScienceMaterials EngineeringElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)NanoelectronicsApplied PhysicsCu Pad ExpansionChip AttachmentSemiconductor Device FabricationElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)