Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations

Christophe Czarnota, K. Kowalczyk-Gajewska, Abdellah Salahouelhadj, +2

International Journal of Solids and Structures

Materials ScienceEngineeringMechanical PropertiesFinite Element CalculationsMechanics +9

Estimation of the size of the RVE for isotropic copper polycrystals by using elastic–plastic finite element homogenisation

Abdellah Salahouelhadj, H. Haddadi

Computational Materials Science

Materials ScienceEngineeringSevere Plastic DeformationMechanical EngineeringMaterial Simulation +4

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Arnita Podpod, John Slabbekoorn, Alain Phommahaxay, +7

Data BandwidthEngineeringShift EvolutionMemory ChipsComputer Architecture +14

Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications

Abdellah Salahouelhadj, M. Martiny, S. Mercier, +3

Microelectronics Reliability

Electrical EngineeringEngineeringHardware ReliabilityAdvanced Packaging (Semiconductors)Circuit Boards +6

Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation

Abdellah Salahouelhadj, Farid Abed‐Meraim, Hocine Chalal, +1

Archive of Applied Mechanics

Materials ScienceEngineeringForming SimulationMechanical BehaviorDeformation Modeling +10

Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

Herman Oprins, Vladimir Cherman, Tomas Webers, +5

EngineeringPassive Test ChipThermal ConductivityAdvanced Packaging (Semiconductors)Wafer Pair +18

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Yan Wen Tsau, Joke De Messemaeker, Abdellah Salahouelhadj, +6

Microelectronics Reliability

Materials ScienceMaterials EngineeringElectrical EngineeringWafer Scale ProcessingEngineering +9

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Abdellah Salahouelhadj, Mario González, Kris Vanstreels, +3

Microelectronic Engineering

Effects of packaging on mechanical stress in 3D-ICs

Vladimir Cherman, Melina Lofrano, Veerle Simons, +10

Materials ScienceDifferent Packaging Configurations3D Ic ArchitectureChip-scale PackageEngineering +12

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Herman Oprins, Vladimir Cherman, Tomas Webers, +5

Journal of Electronic Packaging

Passive Test ChipEngineeringIntegrated CircuitsThermal ConductivityInterconnect (Integrated Circuits) +18