2.5D system integration: a design driven system implementation schema

Abstract

We investigate a 3D die-stacking based VLSI integration strategy, socalled 2.5D integration, which can potentially overcome many problems stumbling the development of monolithic system-on-chip (SoC). Here, we review available fabrication technologies and testing solutions for the new integration strategy. We also propose a design driven system implementation schema for this new integration strategy. A layout synthesis framework is under development by us to analyze typical "what if" questions and resolve major physical attributes for a 2.5D system according to the design specification and constraints.