2021 · 12 citations · 8 references
EngineeringElectrical EngineeringLow-power DesignMicroelectronicsMicrowave EngineeringHigh-frequency Semiconductor DevicesMicrowave Integrated CircuitsRadar SystemsRadio-frequency Integrated CircuitsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsElectronically Scanned ArraysFlip-chip PackagingHeat SinksNoise FigurePower OutputPower Output MeasurementRadio-frequency DevicesRadio-frequency Packaging
This paper describes a tile-type high-transmit-power TR module in order to realize a low-profile AESA (active electronically scanned array) radars. The TR module is based on a newly developed multichip packaging technology featuring top-surface waste heat structure with a flip-chip mounting and heat sinks. Measurements of the prototype TR module show an output power of over 43 dBm (20 W) and a noise figure of 2.8 dB over X-band. This power is the state-of-the-art level among ever reported X-band tile-type TR modules.
8
GaN based wideband T/R module for multi-function applications
Ralf Rieger, A. Klaassen, Patrick Schuh et al. · 2015 · 31 citations
Engineering, Aerospace Engineering, Electrical Engineering +17