Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging

Recent progress on the development of Sn–Bi based low-temperature Pb-free solders

Fengjiang Wang, Hong Chen, Ying Huang et al. · Journal of Materials Science Materials in Electronics · 2019 · 207 citations

Engineering, Materials Engineering, Materials Science +11

Correlation between microstructure and mechanical properties of Sn–Bi–X solders

Omid Mokhtari, Hiroshi Nishikawa · Materials Science and Engineering A · 2015 · 153 citations

Natural Sciences, Materials Engineering, Materials Science +12

Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

Fangqin Hu, Qingke Zhang, Jie Jiang et al. · Materials Letters · 2017 · 87 citations

Natural Sciences, Materials Engineering, Materials Science +13

A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

Chongyang Cai, Jiefeng Xu, Huayan Wang et al. · Microelectronics Reliability · 2021 · 85 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

Shiqi Zhou, Chih-han Yang, Shih‐kang Lin et al. · Materials Science and Engineering A · 2018 · 71 citations

Natural Sciences, Materials Engineering, Materials Science +14