A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections

Abstract

In this paper, we propose a 3D stacked global shutter CMOS image sensor with 3M Cu-Cu connections. Using a fine pitch and a large number of Cu-Cu connection technology, we achieved 1.46M pixels of size 6.9 μm × 6.9 μm. The pixel evaluation results reveal that all the 3M Cu-Cu connections were realized without defect.