2016 · 234 citations · 8 references
EngineeringMaterials ScienceElectronic MaterialsSensorsSystem-on-chip DesignCmos Circuit DesignComplementary Metal-oxide-semiconductor TechnologyDigital Image ProcessingImage SensorsSensor IntegrationWafer BondingCmos Image SensorsComplementary Metal-oxide-semiconductor Image SensorsFlip-chip BondingImage Sensor DesignImage Sensor Technology
We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had developed. The electrical test results showed that our highly robust Cu2Cu hybrid bonding achieved remarkable connectivity and reliability. The performance of image sensor was also investigated and our novel stacked BI-CIS showed favorable results.
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A 1/4-inch 8Mpixel back-illuminated stacked CMOS image sensor
Sho Sukegawa, Taku Umebayashi, Tadaaki Nakajima et al. · 2013 · 191 citations
Stress-induced voiding under vias connected to wide Cu metal leads
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Natural Sciences, Materials Engineering, Materials Science +15
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations