Analysis of no-clean flux spatter during the soldering process

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Robert N. Wenzel · Industrial & Engineering Chemistry · 1936 · 13K citations

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Advances in lead-free electronics soldering

Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 2001 · 725 citations

Engineering, Materials Engineering, Materials Science +7

Wettability versus roughness of engineering surfaces

K.J. Kubiak, Mark C. T. Wilson, Thomas G. Mathia et al. · Wear · 2010 · 651 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat · Journal of Electronic Materials · 2015 · 109 citations

Engineering, Chemistry, Electrical Engineering +15

Reliability issues in Pb-free solder joint miniaturization

Zhiheng Huang, Paul Conway, Erik Jung et al. · Journal of Electronic Materials · 2006 · 42 citations

Engineering, Materials Engineering, Materials Science +8