Karel Dušek

Flux effect on void quantity and size in soldered joints

David Bušek, Karel Dušek, D. Růžička et al. · Microelectronics Reliability · 2016 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +13

Solder joint quality evaluation based on heating factor

Petr Veselý, Eva Horynová, J. Starý et al. · Circuit World · 2018 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +15

Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Balázs Illés, Halim Choi, Tamás Hurtony et al. · Journal of Materials Research and Technology · 2022 · 38 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation

Balázs Illés, Bálint Medgyes, Karel Dušek et al. · International Journal of Heat and Mass Transfer · 2021 · 36 citations · Full text

Natural Sciences, Electrical Engineering, Materials Science +17

Analysis of no-clean flux spatter during the soldering process

Petr Veselý, David Bušek, Olivér Krammer et al. · Journal of Materials Processing Technology · 2019 · 33 citations

Engineering, Materials Engineering, Materials Science +8