Morten Stendahl Jellesen

On the electrochemical migration mechanism of tin in electronics

Daniel Minzari, Morten Stendahl Jellesen, Per Møller et al. · Corrosion Science · 2011 · 130 citations

Electrical Engineering, Engineering, Electrochemical Interface +3

A spot test for detection of cobalt release – early experience and findings

Jacob P. Thyssen, Torkil Menné, Jeanne Duus Johansen et al. · Contact Dermatitis · 2010 · 109 citations

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat · Journal of Electronic Materials · 2015 · 103 citations

Electrical Engineering, Solder Flux Residues, Engineering +4

Electrochemical migration of tin in electronics and microstructure of the dendrites

Daniel Minzari, Flemming Bjerg Grumsen, Morten Stendahl Jellesen et al. · Corrosion Science · 2011 · 79 citations

Materials Science, Chemical Engineering, Engineering +7

Corrosion failure due to flux residues in an electronic add-on device

Morten Stendahl Jellesen, Daniel Minzari, Umadevi Rathinavelu et al. · Engineering Failure Analysis · 2010 · 77 citations

Materials Science, Electronic Add-on Device, Electrical Engineering +9