Integration of Low-<i>k</i> Dielectric Materials Into Sub-0.25-<i>μ</i>m Interconnects

Electronic packaging materials science III

R. J. Jaccodine, Kelly A. Jackson, E.D. Lillie et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 1985 · 147 citations

Engineering, Materials Engineering, Materials Science +17

Advanced Metallization for ULSI Applications

Japanese Journal of Applied Physics · 2022 · 65 citations

Engineering, Materials Engineering, Materials Science +9

Quantitative study of the annealing of poly(vinyl chloride) near the glass transition

Carl R. Foltz, Paul V. McKinney · Journal of Applied Polymer Science · 1969 · 46 citations

Natural Sciences, Chemistry, Materials Science +17

Surface reaction and stability of parylene N and F thin films at elevated temperatures

Peter Wu, G.‐R. Yang, J. F. McDonald et al. · Journal of Electronic Materials · 1995 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +17