Girish Dixit

Electrodeposition of copper–tin alloy thin films for microelectronic applications

Deenesh Padhi, Srinivas Gandikota, Hoa Binh Nguyen et al. · Electrochimica Acta · 2003 · 41 citations

Materials Science, Electrical Engineering, Engineering +6

Integration of Low-<i>k</i> Dielectric Materials Into Sub-0.25-<i>μ</i>m Interconnects

R. S. List, Abha Singh, A.R.K. Ralston et al. · MRS Bulletin · 1997 · 35 citations

Electrical Engineering, Engineering, Applied Physics +4

Overview Of Process Integration Issues For Low K Dielectrics

Robert Havemann, Manoj Kumar Jain, R. S. List et al. · MRS Proceedings · 1998 · 25 citations

Process Integration, Electrical Engineering, Engineering +7

Bicrystal studies of diffusion-induced grain boundary migration in Cu/Zn

Fu-Sen Chen, Girish Dixit, Antonio Aldykiewicz et al. · Metallurgical Transactions A · 1990 · 25 citations

Materials Science, Engineering, Diffusion Resistance +5

Effect of electron flow direction on model parameters of electromigration-induced failure of copper interconnects

Deenesh Padhi, Girish Dixit · Journal of Applied Physics · 2003 · 24 citations

Engineering, Electromigration-induced Failure, Charge Transport +17