Girish Dixit - Concepedia

Author

Girish Dixit

Also Known As

G. A. DIXIT, G. A. Dixit, G.A Dixit, G.A. Dixit, GEETIKA DIXIT, Girish A Dixit, Girish A. Dixit, Girish Dixit, Gunjan Dixit

Publications

320

Citations

H-Index

Concepts

All Affiliations

Texas Instruments (United States)Applied Materials (United States)

About

Girish Dixit is an author at Texas Instruments (United States) specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	239
2	Applied Physics	9	9	159
3	Electrical Engineering	9	9	191
4	Materials Engineering	4	4	51
5	Computer Engineering	1	1	12

Girish Dixit

Publications

239

Citations

H-Index

Page 1

	Year	Citations
Electrodeposition of copper–tin alloy thin films for microelectronic applications Deenesh Padhi, Srinivas Gandikota, Hoa Binh Nguyen, Electrochimica Acta Materials ScienceElectrical EngineeringEngineeringThin Film DevicesMicroelectronic Applications	2003	41
Integration of Low-<i>k</i> Dielectric Materials Into Sub-0.25-<i>μ</i>m Interconnects R. S. List, Abha Singh, A.R.K. Ralston, MRS Bulletin Electrical EngineeringEngineeringApplied PhysicsMicroelectronicsElectrical Property	1997	35
Overview Of Process Integration Issues For Low K Dielectrics Robert Havemann, Manoj Kumar Jain, R. S. List, MRS Proceedings Process IntegrationElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Time-dependent Dielectric Breakdown	1998	25
Bicrystal studies of diffusion-induced grain boundary migration in Cu/Zn Fu-Sen Chen, Girish Dixit, Antonio Aldykiewicz, Metallurgical Transactions A Materials ScienceEngineeringDiffusion ResistanceApplied PhysicsCondensed Matter Physics	1990	25
Effect of electron flow direction on model parameters of electromigration-induced failure of copper interconnects Deenesh Padhi, Girish Dixit Journal of Applied Physics EngineeringElectromigration-induced FailureCharge TransportInterconnect (Integrated Circuits)Electronic Packaging	2003	24
Planarized aluminum metallization for sub-0.5 mu m CMOS technology F.S. Chen, Yi Lin, Girish Dixit, EngineeringConventional Sputtering SystemIntegrated CircuitsThin Film Process TechnologyAl-plug Process	2002	15
Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization Yu‐Pei Chen, Girish Dixit, Jiong-Ping Lu, Thin Solid Films Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)	1998	14
Reactively sputtered titanium nitride films for submicron contact barrier metallization Girish Dixit, C.C. Wei, F.T. Liou, Applied Physics Letters EngineeringCubic Boron NitrideBarrier MetalBoron NitrideThin Film Processing	1993	13
A novel 0.25 μm via plug process using low temperature CVD Al/TiN Girish Dixit, Ajit Paranjpe, Qi‐Zhong Hong, EngineeringChemical DepositionAl Plug TechnologyInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2002	13
Ion metal plasma (IMP) deposited titanium liners for 0.25/0.18 μm multilevel interconnections Girish Dixit, Wei-hui Hsu, A. Konecni, Materials ScienceElectrical EngineeringIon ImplantationEngineeringμM Multilevel Interconnections	2002	12

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