Deenesh Padhi

Planarization of Copper Thin Films by Electropolishing in Phosphoric Acid for ULSI Applications

Deenesh Padhi, J. Yahalom, S. Gandikota et al. · Journal of The Electrochemical Society · 2002 · 59 citations

Engineering, Electrode-electrolyte Interface, Boundary Layer +17

Electrodeposition of copper–tin alloy thin films for microelectronic applications

Deenesh Padhi, Srinivas Gandikota, Hoa Binh Nguyen et al. · Electrochimica Acta · 2003 · 41 citations

Materials Science, Electrical Engineering, Engineering +6

Effect of electron flow direction on model parameters of electromigration-induced failure of copper interconnects

Deenesh Padhi, Girish Dixit · Journal of Applied Physics · 2003 · 24 citations

Engineering, Electromigration-induced Failure, Charge Transport +17

Effects of test temperature and grain size on the charpy impact toughness and dynamic toughness (K ID ) of polycrystalline niobium

Deenesh Padhi, John J. Lewandowski · Metallurgical and Materials Transactions A · 2003 · 17 citations

Materials Science, Engineering, Severe Plastic Deformation +11

Dry etch selectivity of a-C:H hardmasks for sub-65nm patterning applications

Deenesh Padhi, B. H. Kim, Derek Witty · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2009 · 17 citations