Publication | Closed Access
Overview Of Process Integration Issues For Low K Dielectrics
25
Citations
1
References
1998
Year
Process IntegrationElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Time-dependent Dielectric BreakdownLow K DielectricsElectronic PackagingMicroelectronicsElectrical InsulationElectromagnetic Compatibility
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