Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 232 citations

Engineering, Electrical Engineering, Materials Science +17

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations

Natural Sciences, Materials Engineering, Materials Science +16

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu, Chih Chen, Chien‐Neng Liao et al. · Applied Physics Letters · 1999 · 160 citations

Engineering, Electrical Engineering, Materials Engineering +14

Electromigration in Sn–Pb solder strips as a function of alloy composition

C. Y. Liu, Chih Chen, K. N. Tu · Journal of Applied Physics · 2000 · 153 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of current crowding on vacancy diffusion and void formation in electromigration

K. N. Tu, C. C. Yeh, C. Y. Liu et al. · Applied Physics Letters · 2000 · 150 citations

Engineering, Electrical Engineering, Materials Science +17