Kirak Son

Atomic Layer Deposition of Ru for Replacing Cu-Interconnects

Yohei Kotsugi, Seung‐Min Han, Youn‐Hye Kim et al. · Chemistry of Materials · 2021 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +16

Chemical vapor deposition of ultrathin Ta2O5 films using Ta[N(CH3)2]5

Kirak Son, A. Y. Mao, Yong Sun et al. · Applied Physics Letters · 1998 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +16

Ultrathin Ta2O5 film growth by chemical vapor deposition of Ta(N(CH3)2)5 and O2 on bare and SiOxNy-passivated Si(100) for gate dielectric applications

Kirak Son, A. Y. Mao, B. Y. Kim et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1998 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +17

Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump

Gyutae Park, Byeong-Rok Lee, Kirak Son et al. · Electronic Materials Letters · 2018 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +9

Annealing ultra thin Ta2O5 films deposited on bare and nitrogen passivated Si(100)

A. Y. Mao, Kirak Son, D. A. Hess et al. · Thin Solid Films · 1999 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +11