Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn–Cu–Bi solder and Cu substrate

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Acta Materialia · 2010 · 398 citations

Engineering, Materials Engineering, Materials Science +16

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Tomi Laurila, Vesa Vuorinen, Mervi Paulasto‐Kröckel · Materials Science and Engineering R Reports · 2010 · 335 citations

Natural Sciences, Materials Engineering, Materials Science +14

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y.C. Chan, Daoguo Yang · Progress in Materials Science · 2010 · 275 citations

Engineering, Electrical Engineering, Materials Engineering +17

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +16

Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

Kazuhiro Nogita, Tetsuro Nishimura · Scripta Materialia · 2008 · 202 citations

Natural Sciences, Materials Engineering, Materials Science +10