Publication | Closed Access
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
330
Citations
165
References
2010
Year
Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyCorrosionApplied PhysicsPb-free SolderingAlloy DesignMetallurgical InteractionInterfacial Reaction LayersElectronic PackagingCladding (Metalworking)MicrostructureMetal Processing
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