Experimental study on size effect of tool edge and subsurface damage of single crystal silicon in nano-cutting

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

Sanjay Agarwal, P. Venkateswara Rao · International Journal of Machine Tools and Manufacture · 2007 · 326 citations

Engineering, Materials Engineering, Materials Science +17

Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

Jiwang Yan, Tooru Asami, Hirofumi Harada et al. · Precision Engineering · 2008 · 265 citations

Engineering, Materials Engineering, Materials Science +16

Raman microspectroscopy study of processing-induced phase transformations and residual stress in silicon

Yury Gogotsi, Chang‐Wook Baek, F.‐G. Kirscht · Semiconductor Science and Technology · 1999 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16

The influence of rake angle, cutting feed and cutting depth on residual stresses in hard turning

Patrik Dahlman, Fredrik Gunnberg, M.I. Jacobson · Journal of Materials Processing Technology · 2004 · 168 citations

Engineering, Industrial Engineering, Manufacturing Engineering +12

A study on mechanism of nano-cutting single crystal silicon

Fengzhou Fang, Hu Wu, Wei Zhou · Journal of Materials Processing Technology · 2007 · 165 citations

Natural Sciences, Materials Engineering, Materials Science +12