IEEE Transactions on Electron Devices · 2017 · 227 citations · 35 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsMicrowave EngineeringSemiconductor DevicesDevice ScalingHigh-frequency Semiconductor DevicesMicrowave Integrated CircuitsMicrowave Semiconductor DevicesWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsBreakdown VoltageConductivityHigh-electron-mobility TransistorsMaximum Power OutputMillimeter-wave TransistorsPower Added EfficiencyPower DensitySmall-signal Gain
This paper reports on state-of-the-art millimeter-wave power performance of N-polar GaN-based metal-insulator-semiconductor high-electron-mobility transistors at 30 and 94 GHz. The performance is enabled by our N-polar deep recess structure, whereby a GaN cap layer is added in the access regions of the transistor to simultaneously enhance the access region conductivity while mitigating dc-to-RF dispersion. The impact of lateral scaling of the drain access region length is examined using the tradeoff between breakdown voltage and small-signal gain. Load-pull measurements are presented at 94 GHz, corresponding to the target device operating frequency in W-band, where the device demonstrated a peak power-added efficiency (PAE) of 28.8% at 16 V and record-high maximum output power density of 8 W/mm at 20 V. Additional load-pull measurements at 30 and 10 GHz demonstrate the viability of this device across a wide frequency range where the peak power remained constant at 8 W/mm and with peak PAEs of 56% and 58%, respectively.
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High-power AlGaN/GaN HEMTs for Ka-band applications
Tomás Palacios, A. Chakraborty, Siddharth Rajan et al. · IEEE Electron Device Letters · 2005 · 492 citations · Full text
Tomás Palacios, Siddharth Rajan, A. Chakraborty et al. · IEEE Transactions on Electron Devices · 2005 · 209 citations