Prominent interface structure and bonding material of power module for high temperature operation

Abstract

Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of sintered Ag bonding may be possible degradation of interfacial strength at high temperatures. Molding process is thus important for supporting the die-attach in the encapsulated power module once certain adhesion strength is assured between a lead-flame and mold resin. We propose a prominent interface structure using novel bonding materials for electronic power modules targeting high-temperature operation.