Gerhard Palm

Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

Nicolas Heuck, Andrej Stranz, Gerhard Palm et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 50 citations

Engineering, Materials Engineering, Materials Science +17

Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach

J. Kähler, Nicolas Heuck, Gerhard Palm et al. · European Microelectronics and Packaging Conference · 2011 · 28 citations

Engineering, Materials Engineering, Materials Science +16

SiC-Die-Attachment for High Temperature Applications

Nicolas Heuck, Gerhard Palm, T. Sauerberg et al. · Materials science forum · 2010 · 17 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Die-attach for high-temperature applications using fineplacer-pressure-sintering (FPS)

J. Kähler, Nicolas Heuck, Gerhard Palm et al. · 2010 · 15 citations

Engineering, Materials Engineering, Materials Science +14

Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C

Nicolas Heuck, Sebastian Müller, Gerhard Palm et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2010 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +17