Concepedia

Nicolas Heuck

NH

Statistics

Publications

13

Citations

417

H-Index

13

Active since

2010

Affiliations

Technische Universität Braunschweig(Current)

Infineon Technologies (Germany)

Nicolas Heuck is an author at Technische Universität Braunschweig specializing in materials science, engineering, and materials engineering.

Publications per year

2010–2016

13

Publications

13

Sintering of Copper Particles for Die Attach

J. Kähler, Nicolas Heuck, Alexander Wagner et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +15

Pick-and-Place Silver Sintering Die Attach of Small-Area Chips

J. Kähler, Nicolas Heuck, Andrej Stranz et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 54 citations

Engineering, Materials Engineering, Materials Science +17

Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

Nicolas Heuck, Andrej Stranz, Gerhard Palm et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 50 citations

Engineering, Materials Engineering, Materials Science +17

New assembly and interconnect technologies for power modules

Karsten Guth, N. Oeschler, L. Boewer et al. · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) · 2012 · 49 citations

Engineering, Electrical Engineering, Materials Science +17

Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling

Nicolas Heuck, Karsten Guth, M. Thoben et al. · 2014 · 34 citations

Engineering, Electrical Engineering, Materials Science +11

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