Nicolas Heuck

Sintering of Copper Particles for Die Attach

J. Kähler, Nicolas Heuck, Alexander Wagner et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 89 citations

Materials Science, Materials Engineering, Copper Particles +11

Pick-and-Place Silver Sintering Die Attach of Small-Area Chips

J. Kähler, Nicolas Heuck, Andrej Stranz et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 53 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +17

New assembly and interconnect technologies for power modules

Karsten Guth, N. Oeschler, L. Boewer et al. · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) · 2012 · 49 citations

Engineering, Silver Particles, Power Electronics +18

Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives

Nicolas Heuck, A. Langer, Andrej Stranz et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 47 citations

Special Filling Materials, Engineering, Mechanical Engineering +24

Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling

Nicolas Heuck, Karsten Guth, M. Thoben et al. · 2014 · 34 citations

Electrical Engineering, New Interconnect-technologies, Engineering +7