Tomohito Iwashige

High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates

Chuantong Chen, Katsuaki Suganuma, Tomohito Iwashige et al. · Journal of Materials Science Materials in Electronics · 2017 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +11

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Chuantong Chen, Shijo Nagao, Katsuaki Suganuma et al. · Acta Materialia · 2017 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +14

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Chuantong Chen, Shijo Nagao, Hao Zhang et al. · Journal of Electronic Materials · 2016 · 93 citations

Engineering, Materials Engineering, Materials Science +17

Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure

Kazuhiko Sugiura, Tomohito Iwashige, Kazuhiro Tsuruta et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 74 citations

Engineering, Materials Engineering, Materials Science +17

Self-healing of cracks in Ag joining layer for die-attachment in power devices

Chuantong Chen, Shijo Nagao, Katsuaki Suganuma et al. · Applied Physics Letters · 2016 · 46 citations

Natural Sciences, Materials Engineering, Materials Science +14