Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Wafer level packaging of MEMS

Masayoshi Esashi · Journal of Micromechanics and Microengineering · 2008 · 353 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system

Nick Bosco, Frank W. Zok · Acta Materialia · 2004 · 208 citations

Natural Sciences, Materials Engineering, Materials Science +14

Strength of joints produced by transient liquid phase bonding in the Cu–Sn system

Nick Bosco, Frank W. Zok · Acta Materialia · 2005 · 127 citations

Natural Sciences, Materials Engineering, Materials Science +13

Thickening kinetics of interfacial Cu6Sn5 and Cu3Sn layers during reaction of liquid tin with solid copper

R. A. Gagliano, M. E. Fine · Journal of Electronic Materials · 2003 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +16

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Thi‐Thuy Luu, Ani Duan, Knut E. Aasmundtveit et al. · Journal of Electronic Materials · 2013 · 83 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15