Concepedia
Statistics
Publications
6
Citations
142
H-Index
Active since
2014
Affiliations
Tsinghua University(Current)
Dalian University of Technology
Institute of Microelectronics
Zijian Wu is an author at Tsinghua University specializing in materials science, materials engineering, and metals.
Publications per year
2014–2017
Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection
Junqiang Wang, Qian Wang, Ziyu Liu et al. · Applied Surface Science · 2016 · 36 citations
Natural Sciences, Materials Engineering, Materials Science +16
Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration
Junqiang Wang, Qian Wang, Zijian Wu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 29 citations
Engineering, Electrical Engineering, Materials Science +16
Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition
Zijian Wu, Jian Cai, Junqiang Wang et al. · Journal of Electronic Materials · 2017 · 26 citations
Natural Sciences, Materials Engineering, Materials Science +12
Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness
Zijian Wu, Jian Cai, Qian Wang et al. · Journal of Electronic Materials · 2017 · 25 citations
Engineering, Electrical Engineering, Materials Science +12
Optimization and evaluation of sputtering barrier/seed layer in through silicon via for 3-D integration
Tiwei Wei, Jian Cai, Qian Wang et al. · Tsinghua Science & Technology · 2014 · 15 citations · Full text
Engineering, Materials Engineering, Materials Science +15
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