Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

Y. Kagawa, Nobutoshi Fujii, Kenichi Aoyagi et al. · 2016 · 234 citations

Engineering, Materials Science, Electronic Materials +13

Silver Nanoparticle Paste for Low-Temperature Bonding of Copper

Hani Alarifi, Anming Hu, Mustafa Yavuz et al. · Journal of Electronic Materials · 2011 · 152 citations

Natural Sciences, Materials Engineering, Materials Science +14

Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles

Toshiaki Morita, Y. Yasuda, Eiichi Ide et al. · MATERIALS TRANSACTIONS · 2008 · 97 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

Hysteresis of Transistor Characteristics of Amorphous IGZO TFTs Studied by Controlling Measurement Speed

Y.-J. Chen, Ya‐Hsiang Tai · ECS Solid State Letters · 2015 · 19 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Electrical and optical characterisation of capacitively and inductively coupled GEC reference cells

W. G. Graham, C. M. O. Mahony, P. G. Steen · Vacuum · 2000 · 17 citations

Engineering, Electrical Engineering, Materials Science +10