Ani Duan

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Thi‐Thuy Luu, Ani Duan, Knut E. Aasmundtveit et al. · Journal of Electronic Materials · 2013 · 82 citations · Full text

Bonding Process, Engineering, Interconnect (Integrated Circuits) +18

Cu/Sn SLID wafer-level bonding optimization

Thi‐Thuy Luu, Ani Duan, Kaiying Wang et al. · 2013 · 15 citations

Materials Engineering, Materials Science, Advanced Packaging +15

Reducing the bond frame width in Cu/Sn SLID wafer level packaging

Ani Duan, Kaiying Wang, Knut E. Aasmundtveit et al. · 2012 4th Electronic System-Integration Technology Conference · 2012 · 12 citations

Wafer-level Cu–Sn micro-joints with high mechanical strength and low Sn overflow

Ani Duan, Thi‐Thuy Luu, Kaiying Wang et al. · Journal of Micromechanics and Microengineering · 2015 · 12 citations

Engineering, Mechanical Engineering, Bond Frame +21