A novel buried oxide isolation for monolithic RF inductors on silicon

H.B. Erzgraber, T. Grabolla, H. Richter, P. Schley, A. Wolff

2002 · 28 citations · 3 references

Concepts

Abstract

We present a new approach to realizing high quality factor (Q) inductors using CMOS-compatible process steps only. The method is based on the preparation of very thick buried oxide regions beneath the inductors to reduce parasitics. The behavior of inductors fabricated with a CMOS compatible, 3-level metal silicon technology conforms well with simulations.

References

3