Publication | Closed Access
Planarized aluminum metallization for sub-0.5 mu m CMOS technology
15
Citations
2
References
2002
Year
Unknown Venue
EngineeringConventional Sputtering SystemIntegrated CircuitsThin Film Process TechnologyAl-plug ProcessInterconnect (Integrated Circuits)Wafer Scale ProcessingThin Film ProcessingThin-film TechnologyMaterials EngineeringMaterials ScienceElectrical EngineeringAluminum MetallizationSemiconductor Device FabricationMicroelectronicsMicrostructureMicrofabricationSurface ScienceApplied PhysicsThin Film DevicesThin FilmsAluminum Sputter Process
The authors describe an aluminum sputter process, called the Al-plug process, which results in complete filling of submicron contacts and vias of various sizes. The process can be done in a conventional sputtering system. Material and electrical characterization of the film and the implementation of this process in submicron integrated circuits are presented.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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