Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling

Abstract

This paper reports on the integration and packaging of embedded radial micro-channels for 3D chip cooling. A thermal demonstration vehicle (TDV) has been designed, fabricated and assembled. Radial micro-channels based on deep Si etching was integrated with a manifold chip to form a 2-layer chip stack, which has been assembled using a ceramic substrate and a Cu manifold. A test vehicle with an effective critical heat flux of 340 W/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and uniform cooling has been successfully demonstrated using a dielectric coolant (R1234ze).