Gerard McVicker

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Thermomechanical modeling of 3D electronic packages

Sri M. Sri-Jayantha, Gerard McVicker, K. Bernstein et al. · IBM Journal of Research and Development · 2008 · 68 citations

Engineering, Mechanical Engineering, Complex Electronic Packages +23

A remote center of motion robotic arm for computer assisted surgery

Benjamin N. Eldridge, Kreg G. Gruben, D. Larose et al. · Robotica · 1996 · 40 citations

Robot Kinematics, Robotic Systems, Engineering +23

Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling

Madhusudan Iyengar, Roger Schmidt, Arun Sharma et al. · 2005 · 33 citations

Engineering, Energy Efficiency, Rack Heat Load +17

The Hummingbird minipositioner-providing three-axis motion at 50 g's with low reactions

J. P. Karidis, Gerard McVicker, J.P. Pawletko et al. · 2003 · 31 citations

Engineering, Low Reactions, Hummingbird Minipositioner +19