Sri M. Sri-Jayantha

Statistics

Publications

Citations

913

H-Index

Active since

2001

Affiliations

IBM Research - Thomas J. Watson Research Center(Current)

IBM (United States)

IBM Research - Tokyo

Sri M. Sri-Jayantha is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, chip packaging, and electrical engineering.

Publications per year

2001–2008

Publications

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +17

Thermomechanical modeling of 3D electronic packages

Sri M. Sri-Jayantha, Gerard McVicker, K. Bernstein et al. · IBM Journal of Research and Development · 2008 · 68 citations

Engineering, Materials Science, Computational Heat Transfer +16

TrueTrack/sup TM/ servo technology for high TPI disk drives

Sri M. Sri-Jayantha, Hien Dang, A. Sharma et al. · IEEE Transactions on Magnetics · 2001 · 34 citations

Engineering, Mechanical Engineering, Mechatronics Engineering +14

Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling

Madhusudan Iyengar, Roger Schmidt, Arun Sharma et al. · 2005 · 33 citations

Engineering, Mechanical Engineering, Air Conditioning +16

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