Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions

A.A. El-Daly, A.E. Hammad, A. Fawzy et al. · Materials & Design (1980-2015) · 2012 · 156 citations

Natural Sciences, Materials Engineering, Materials Science +16

Drop impact reliability testing for lead-free and lead-based soldered IC packages

Desmond Y. R. Chong, J.H.L. Pang, Kellin Ng et al. · Microelectronics Reliability · 2005 · 155 citations

Engineering, Electrical Engineering, Materials Science +13

Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

Guang Ren, Ian J. Wilding, Maurice N. Collins · Journal of Alloys and Compounds · 2016 · 127 citations

Engineering, Materials Engineering, Materials Science +14

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Richard Coyle, Keith Sweatman, Babak Arfaei · JOM · 2015 · 95 citations · Full text

Engineering, Materials Engineering, Materials Science +17

CCGA packages for space applications

Reza Ghaffarian · Microelectronics Reliability · 2006 · 85 citations

Engineering, Aerospace Engineering, Computer Engineering +13