Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Tomi Laurila, Vesa Vuorinen, Mervi Paulasto‐Kröckel · Materials Science and Engineering R Reports · 2010 · 335 citations

Natural Sciences, Materials Engineering, Materials Science +14

Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation

Xin Deng, Nikhilesh Chawla, K. K. Chawla et al. · Acta Materialia · 2004 · 313 citations

Natural Sciences, Materials Engineering, Materials Science +14

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

K. N. Tu, Hsiang‐Yao Hsiao, Chih Chen · Microelectronics Reliability · 2012 · 186 citations

Engineering, Materials Engineering, Materials Science +15

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate

S.L. Tay, A.S.M.A. Haseeb, Mohd Rafie Johan et al. · Intermetallics · 2012 · 139 citations

Natural Sciences, Materials Engineering, Materials Science +17

Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates

Yue Gu, Xiuchen Zhao, Yi Li et al. · Journal of Alloys and Compounds · 2014 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +16