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Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

Materials ScienceEngineeringPower UltrasoundMechanical EngineeringApplied PhysicsMicromachined Ultrasonic TransducerUltrasoundUltrasonic Vibration TimeCu/sn-ag-cu/cu Joint